1.Introduction and applicaton

• For handling and separation of extremely thin workpieces without permanent deformation (e.g. film, paper, wood veneer)
• Handling highly permeable workpieces, (e.g.printed circuit boards without electronic components installed).
• Handling vulnerable workpieces (e.g. silicon wafers and battery wafers)

2.Structure

• Connection directly via four mounting threads (1) on the top side;
• Vertical (2) and horizontal compressed air connections;
• Horizontal-direction compressed air connection hole (closed with plug);
• The main material is anodized aluminumy with integrated bernoulli nozzle (3);
• Streaming element (4) in two versions: standard flow SF for airtight workpieces and high flow HF for higher leakage compensation on porous workpieces;
• Mark-free rubber buffer of special material HT1 on the bottom side of the suction cup (5);
• Optional available with central suppor;

3.Technology Data:

4.Design data

Contactless suction cup MBN.pdf